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19-4946; Rev 0; 10/09
TION KIT EVALUA BLE ILA AVA
RF Power Detector
Features
S -25dBm to 0dBm Power Detection Range S 0.5dB Detection Error Due to Temperature S +2.7V to +5V Single-Supply Operation S Space-Saving 4-Bump, 1mm2 UCSPTM Package S On-Chip 50I Termination and DC-Blocking
General Description
The MAX2209 is a wideband (800MHz to 2GHz) RF power detector. It takes an RF signal from the directional coupler at the input, and outputs a DC voltage proportional to the RF peak voltage. The change in output voltage versus temperature is very repeatable from part to part and enables a lookup table based on nominal behavior, minimizing the effective detection error to less than Q0.5dB relative to room temperature. The MAX2209 comes in a space-saving 2 x 2, 0.5mm pitch wafer-level package (WLP) and requires only two external components.
MAX2209
Capacitor
Applications
Dual-Band WCDMA Handsets High-Speed Downlink Packet Access (HSDPA) High-Speed Uplink Packet Access (HSUPA)
PART MAX2209EBS+
Ordering Information
TEMP RANGE -40NC to +85NC PINPACKAGE 4 UCSP TOP MARK AGJ
+Denotes a lead(Pb)-free/RoHS-compliant package.
Pin Configuration/Functional Diagram/Typical Operating Circuit
MAX2209
ADC A1 OUT A2 VCC
VCC
B1 GND
B2 RFIN
RF INPUT
UCSP is a trademark of Maxim Integrated Products, Inc.
_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
RF Power Detector MAX2209
ABSOLUTE MAXIMUM RATINGS
VCC to GND.............................................................-0.3V to +6V RFIN to GND ......................................... -0.3V to + (VCC + 0.3V) OUT to GND .......................................... -0.3V to + (VCC + 0.3V) RFIN Input Power .......................................................... +10dBm Continuous Power Dissipation (TA = +70NC) 4-Bump WLP (derate 3mW/NC above +70NC).............238mW Junction-to-Ambient Thermal Resistance (BJA) (Note 1) ..........................................335NC/W Operating Temperature Range .......................... -40NC to +85NC Storage Temperature Range............................ -65NC to +160NC Junction Temperature ....................................................+150NC Bump Temperature (soldering, Note 2) Infrared (15s) ...............................................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.0V, TA = -40NC to +85NC, no RF signal applied. Typical values are at VCC = 2.8V, TA = +25NC, unless otherwise noted.) (Note 3) PARAMETER Supply Voltage Supply Current Idle Output Voltage Output Current Source Capability Output Current Sink Capability VCC = 2.8V, no RF signal PIN = 0dBm, VOUT forced to 0.5V No RF signal, VOUT forced to 2V 750 300 CONDITIONS MIN 2.7 3.6 35 1800 525 TYP MAX 5.0 6 UNITS V mA mV FA FA
AC ELECTRICAL CHARACTERISTICS
(TA = -40NC to +85NC, 50I system, VCC = 2.8V. Typical values are at TA = +25NC, unless otherwise noted.) (Note 3) PARAMETER RF Input Frequency RF Input VSWR Output Voltage, 836MHz Output Voltage, 1950MHz Residual Error after Room Temperature Calibration (TA = -40NC to +85NC) (Note 4) 800MHz 2000MHz -5dBm input -25dBm input -5dBm input -25dBm input -5dBm input -25dBm input CONDITIONS MIN 800 -17 -12 0.88 0.06 0.72 0.06 Q0.5 Q1.5 TYP MAX 2000 UNITS MHz dB V V
dB
Note 3: Guaranteed by production test at TA = +25NC. Guaranteed by design and characterization at TA = -40NC and TA = +85NC. Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics.
2
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RF Power Detector
Typical Operating Characteristics
(VCC = 2.8V, typical values are at TA = +25NC, unless otherwise noted.)
MAX2209
OUTPUT VOLTAGE vs. INPUT POWER (RF = 836MHz)
MAX2209 toc01
OUTPUT VOLTAGE vs. INPUT POWER (RF = 1950MHz)
MAX2209 toc02
OUTPUT VOLTAGE vs. FREQUENCY
MAX2209 toc03
10
10
1 PIN = -5dBm
1 OUT (V) OUT (V)
1 OUT (V) 0.1 PIN = -10dBm
0.1
0.1
PIN = -15dBm
0.01 -25 -20 -15 -10 -5 0 INPUT POWER (dBm)
0.01 -25 -20 -15 -10 -5 0 INPUT POWER (dBm)
0.01 0 500 1000 1500 2000 2500 3000 3500 INPUT FREQUENCY (MHz)
ERROR DUE TO TEMPERATURE (RF = 836MHz, 58 UNITS)
MAX2209 toc04
ERROR DUE TO TEMPERATURE (RF = 1950MHz, 58 UNITS)
MAX2209 toc05
SIGMA OF -40C ERROR
0.14 0.12
MAX2209 toc06
1.5 1.0 0.5 -40C
1.5 1.0 0.5
ERROR (dB) -40C
0.16
ERROR (dB)
0 -0.5 -1.0 -1.5 -25 -20 -15 -10 -5 0 INPUT POWER (dBm) +85C
0 -0.5
+85C
SIGMA (dB)
0.10 0.08 0.06 0.04 0.02 0
RF = 836MHz
RF = 1950MHz
-1.0 -1.5 -25 -20 -15 -10 -5 0 INPUT POWER (dBm)
-25
-20
-15
-10
-5
0
INPUT POWER (dBm)
SIGMA OF +85C ERROR
MAX2209 toc07
RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION
MAX2209 toc08
RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION
0.4 0.3 0.2 ERROR (dB) 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 RF = 836MHz, 58 UNITS, +85C
MAX2209 toc09
0.12 0.10 0.08 SIGMA (dB)
0.5 0.4 0.3 0.2 ERROR (dB) 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 RF = 836MHz, 58 UNITS, -40C
0.5
RF = 1950MHz 0.06 0.04 0.02 0 -25 -20 -15 -10 -5 0 INPUT POWER (dBm) RF = 836MHz
-25
-20
-15
-10
-5
0
-25
-20
-15
-10
-5
0
INPUT POWER (dBm)
INPUT POWER (dBm)
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3
RF Power Detector MAX2209
Typical Operating Characteristics (continued)
(VCC = 2.8V, typical values are at TA = +25NC, unless otherwise noted.)
RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION
MAX2209 toc10
RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION
MAX2209 toc11
0.4 0.3 0.2
ERROR (dB)
RF = 1950MHz, 58 UNITS, -40C
0.4 0.3 0.2
ERROR (dB)
RF = 1950MHz, 58 UNITS, +85C
1.0 0.8 OUT (V) 0.6 0.4 PIN = -10dBm 0.2 PIN = -15dBm 0 0.0E+00
PIN = -5dBm PIN = -7dBm
0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 -25 -20 -15 -10 -5 0 INPUT POWER (dBm)
0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 -25 -20 -15 -10 -5 0 INPUT POWER (dBm)
5.0E-07
1.0E-06 TIME (s)
1.5E-06
2.0E-06
4
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MAX2209 toc12
0.5
0.5
SETTLING TIME FROM RF POWER (ON/OFF RF = 836MHz)
RF Power Detector
Pin Description
BUMP A1 A2 B1 B2 NAME OUT VCC GND RFIN Detector Output Power Supply. Bypass to GND with a capacitor as close as possible to the bump. Ground Connection. Connect to PCB ground plane with as low inductance as possible. RF Input. Internally terminated to 50I. AC-couple the RF input to this pin. FUNCTION
MAX2209
Detailed Description
The MAX2209 power detector is designed to operate from 800MHz to 2.0GHz. The device is ideal for wideband code-division multiple access (WCDMA), cdma2000M, and high-speed downlink/uplink packet access. The MAX2209 accepts an RF signal at the input, and outputs a temperature-independent voltage related to the input signal voltage. The output voltage expressed in dBV is proportional to the input power expressed in dBm. The device has a detection range from -25dBm to 0dBm.
PA DIRECTIONAL COUPLER TO ANTENNA
MAX2209
VCC ADC A1 OUT A2 VCC
Applications Information
The MAX2209 contains an internal termination resistor for use with directional couplers. The typical application circuit is shown in Figure 1. The output of the detector goes to an ADC for further processing by the baseband system. Connect a series resistor and shunt capacitor to the MAX2209 output to reduce residual amplitude ripple.
B1 GND
B2 RFIN
RF INPUT
Layout
There are two areas that require attention: the GND pin and the supply bypassing. Connect the GND pin to the PCB ground with a GND via as close as possible, and bypass VCC to ground with a capacitor as close as possible to the part.
Figure 1. Typical Application Circuit
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE 4 UCSP PACKAGE CODE B4+4 DOCUMENT NO. 21-0117
Chip Information
PROCESS: BIPOLAR
cdma2000 is a registered trademark of the Telecommunications Industry Association.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
(c)
5
2009 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.

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